Product Introduction

FC-SOT23 is a SOT23 packaging form that uses flip chip technology

Product Features

Based on the mature SOT23 packaging process, it has been improved and has good compatibility with existing surface mount technology (SMT) production lines. It can achieve production without large-scale equipment updates, reducing production costs and difficulties, and improving production efficiency.

The pin count and layout characteristics of SOT23 package, but FC-SOT23 can flexibly design the electrical functions of pins according to different chip functions and application requirements, such as power pins, ground pins, signal input and output pins, etc., to meet the requirements of various circuit topologies and find suitable application scenarios in different types of electronic devices.

application

Power amplifier, low-noise amplifier, switching regulator, audio amplifier, Bluetooth module, Wi Fi module, GPS navigation module, such as temperature sensor, pressure sensor, displacement sensor, etc.

process characteristics

flip chip technology

Using flip chip technology, the active area of the chip is facing the substrate, and the interconnection between the chip and the substrate is achieved through solder bumps arranged in an array on the chip. This method shortens the transmission distance of electrical signals, reduces adverse effects such as resistance and inductance, effectively improves the electrical performance of chips, and can meet the requirements of high-frequency and high-speed signal processing.

Reliable electrical connection

By achieving electrical connection between bumps and substrates, compared to traditional wire bonding, parasitic parameters caused by bonding wires are reduced, the stability and reliability of signal transmission are improved, and the risk of electromagnetic interference (EMI) is also reduced.